TECHNET Archives

October 2003

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
multipart/alternative; boundary="part1_17f.216ca22d.2cb3e282_boundary"
Sender:
TechNet <[log in to unmask]>
Subject:
PTH Cu Plating Thickness-To Be or Not to Be (Class II)
From:
"H. S. Miller" <[log in to unmask]>
Date:
Tue, 7 Oct 2003 05:33:54 EDT
MIME-Version:
1.0
X-To:
[log in to unmask]
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
text/plain (2317 bytes) , text/html (2927 bytes)

ATOM RSS1 RSS2