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| From [log in to unmask] Thu Jul 31 12: |
55:01 1997 |
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| >From willli Thu Jul 31 08: |
32:15 1997 |
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Thu, 31 Jul 1997 09:42:40 -0400 (EDT) |
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In a message dated 97-07-30 16:39:05 EDT, you write:
>
> 1. "Developing the Paste-in-hole Process", Tom Grevascio, Group
> Technologies, Surface Mount International Proceedings, 1994 or
> Circuit Assembly, Oct. 1995.
>
You might try Teresa Gentry at Circuits Assembly - her e-mail is
[log in to unmask]
> 2. "Through Hole Connector Soldering with Solder Paste Reflow", Bill
> Barthel, Electronic Assembly Corp., Surface Mount International
> Proceedings, 1994.
>
Bill Barthel, EAC, can be reached at 414-751-3651.
Doug Pauls
CSL
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