Janet,
Enclosed is a more detailed brochure.
Thanks
Richard Haynes
609-497-4584
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PLATING, SURFACE FINISHING AND CORROSION ISSUES
IN
ELECTROMAGNETIC COMPLIANCE & INTERFERENCE
By Richard Haynes
Who should attend:
Electroplaters, surface finishers, corrosion engineers and their management, product managers, procurement managers and other management who have a business, want to start a business or expand their present business to include Global customers and need a more complete understanding of plating and surface finishing as related to the quality of electronic products that have EMC/EMI/ESD standards to meet. Showing customers a more complete understanding of how the quality plating and surface finishing is important to the overall electronic product is an important and achievable task as done in this course.
Description of the Course: This one day course integrates plating, surface finishing and corrosion technologies with Electromagnetic Interference/Radio Frequency Interference(EMI/RFI) shielding and metal joining needs of electronic and Electromagnetic Compliance(EMC) industries. Sufficient shielding practice is given to provide an understanding of: (1) how to get the properties of plated deposits and surface finishes needed for good shielding effectiveness and (2) what happens when the deposit and surface finishes are subjected to corrosive environments. Methods are discussed for measuring essential EMI/RFI properties of deposits and surface finishes required for good quality control. Commonly used plated metals and surface finishes in the EMC industry are discussed. Sufficient corrosion fundamentals are given so it is clear what makes a good joint and how to process it. The use of gaskets and design considerations used to reduce corrosion are discussed. By the end of class it will be clear how plating and surface finishing contributes to the electronic and EMC industry.
Objectives and Benefits
o Understand materials and design problems associated with EMC/EMI/RFI/EOS/ESD as related to the plating and surface finishing industry
o Identify prevalent corrosion phenomena between plated bi-metal couples and surface finishes commonly used in the EMC industry
o Understand design and materials aspects of shielding technologies as related to plated deposit properties and surface finishes
o Learn to avoid corrosion problems by proper choice of plated metals and surface finishes
o Learn how to use metal selection and gasket design to increase the quality of the joint or seam
o Understand sufficient EMI/RFI principles so interaction with customers is mutually profitable
Major Topics
o Fundamentals of shielding effectiveness sufficient to understand the concepts of emission and immunity in electronic products
o Properties of plated deposits needed for acceptable shielding effectiveness
o EMI/RFI measurement techniques used to establish shielding effectiveness of plated deposits and effectiveness of surface finishes at joints
o Review of plated deposits and surface films commonly use in the EMC industry
o Techniques used to choose materials and designs to minimize galvanic and other forms of corrosion
o How to use plated gaskets to increase shielding effectiveness and decrease emissions from electronic products
o Potential problem areas for using plated plastics as shielding materials for EMI and ESD
o Review of competitive methods including economics
o New plating and surface finishing techniques with applications to the EMC industry
o Non chromium containing films for the EMC industry
About the Instructor
Richard Haynes earned a Ph.D. in electrochemistry from the University of Pennsylvania and completed Post-Doctoral study in the areas of Lithum, Nitrogen, Proton Magnetic and Electron Spin Resonance in Metal Solutions. After a distinguished 26 year career he recently retired from AT&T Bell Laboratories. During this period, he developed expertise in EMI shielding technologies and design, applications of magnetic probes to EMC, electroplating and surface finishing, industrial ecology, reliability, corrosion and film growth and battery technology for portable products. His work has resulted in 7 patents( 2 pending) and over 35 technical papers. He is a member of IEEE EMC, The Electrochemical Society, American Electroplaters and Surface Finishers Society, and American Society for Testing and Materials serving on several committees such as Metal Finishing and EMI Materials. He was a member of a team that received the IR100 Award for the Best Industrial Development during 1983, and in 1995 he earned an AT&T Global Manufacturing and Engineering Technical Excellence Award. He serves as a consultant for several large companies. Richard can be contacted at 1-800-890-4634 or through e-mail : [log in to unmask] and Voice/FAX: 609-497-4792.
Richard is uniquely qualified to design and teach this course since he has published both in the plating and surface finishing technologies, Plating and Surface Finishing, J. Applied Electrochemistry and J. Electrochemical Society and EMC Society Proceedings and has given tutorials in both IEEE EMC and EOS/ESD Societies .
-----Original Message-----
From: Janet Lee <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Cc: Jim Ho <[log in to unmask]>
Date: Wednesday, November 04, 1998 6:22 PM
Subject: Electroplating and Surface Finishing Society National Convention
Dear Richard,
I work in a PCB manufacturing company. I've heard that you'll give a course at the Electroplating and Surface Finishing Society National Convention in June 99. We are interested in this course. Would you give me more information about it? For example, the schedules, training subjects, and is there any information available in web site. Thank you very much.
Janet Lee
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