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Wed, 22 Apr 1998 12:07:35 -0400 |
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Cu diffuses into the Au layer readily,especially since Immersion Au is more
porous than other types... oxidation of this metal compound is extremely
difficult to remove suing standard soldering practices...Ni acts as a barrier
layer ...
Marcelo
-----Original Message-----
From: Scott M. Severson [SMTP:[log in to unmask]]
Sent: Wednesday, April 22, 1998 12:47 PM
To: [log in to unmask]
Subject: [TN] Ni plating and Immersion Au
Why is nickel plating used with immersion gold processes when copper
could
provide a solderable surface under the gold?
Thanks
Scott Severson
Benchmark Electronics Inc.
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