I may be misinterpreting this requirement, but if the reason for the "long"
gold pins sticking through the board is to mate to "something else" on that
particular side (opposite the receptacle side) of the board (that's why your
hand soldering effort worked and you didn't get "a pimple" of solder on the
pins), how are you going to prevent the solder from the donuts wicking down
the pins (onto the gold) during your reflow process and contaminating the
"mating interface"?

Martha Rupert
AMP Incorporated

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################