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16:45 1997 |
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Thu, 20 Mar 1997 16:45:03 -0500 |
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Prologue:
Epilogue:
Immersion Au will probably be too thin, and not provide a strong enough wire
bond joint. The I-Au is porous. Most wire bond is done with 30 microinches or
thicker Au.
---------------------- Forwarded by Jim Herard/Endicott/IBM on 03-20-97 11:56 AM
---------------------------
TechNet-request @ ipc.ipc.org
03-20-97 12:38 AM
To: Technet @ ipc.org@internet
cc:
Subject: Wire bonding
To all technet users ,
Currently we are having a discussion on the wire bonding with the
ENIG , immersion gold process .I am interested to know the gold
quality to enable to be applicable for wire bonding purpose .Any
comments are highly welcome .Thanks .
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