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Subject:	Re: Solder paste on Test Point
From:	Manon Dutil <[log in to unmask]>
Reply To:	Manon Dutil <[log in to unmask]>
Date:	Wed, 25 Aug 1999 15:50:39 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (47 lines)

What is there gold, easier TP to reach because of the solder on them. Do not
forget the flux residues if no clean flux is use.


-----Message d'origine-----
De : Nick Nicolaides <[log in to unmask]>
À : [log in to unmask] <[log in to unmask]>
Date : 25 août, 1999 15:10
Objet : [TN] Solder paste on Test Point


>On double reflow boards our ICT test engineers now want to solder paste the
>solder side test points prior to reflow. We do not see any advantage to
this
>but about 2000 more holes in the stencil. What are your ICT people saying.
>
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