TECHNET Archives

October 2015

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
text/plain; charset="utf-8"
X-To:
TechNet E-Mail Forum <[log in to unmask]>
Date:
Thu, 29 Oct 2015 07:32:56 +0000
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Deng RongJun <[log in to unmask]>
Subject:
No-wetting on Mini USB (Nickel plating)
From:
Deng RongJun <[log in to unmask]>
Message-ID:
<[log in to unmask]>
MIME-Version:
1.0
Content-Transfer-Encoding:
base64
Sender:
TechNet <[log in to unmask]>
Parts/Attachments:
text/plain (1 lines) 
Hi Technetters

I have got a problem with a SMT type mini USB connector. The four pins contacted shield are no-wetting after reflow soldering.  But can be solder well by iron.
The pins only plated by Nickel, is it possible the oxidation film creating on pin surface and then affect soldering? 

Picture:
https://goo.gl/photos/qap1CBEWzUEJEc5i6

Thanks in advance.
 
RongJun Deng


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2