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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 4 Nov 1999 16:42:04 -0500 |
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Hi Rudy!
> Vee haf vays off dealing with dies problem, jah?
>
Jah. Especially if you watched 'Laugh In' apparently. What are de
ways O Jedi Master?
> You are baking the boards after applying a corrosive mixture like flux to
> the
> surface? Jah?
>
The flux is RMA so it isn't toooo corrosive but yes.
> If you were NOT getting corrosion, I would be surprised.
>
We don't get corrosion all the time just often enough that I want to
nail the sucker down and drive on.
> It is my guess, that if the corrosion is not on the board before this
> step,
>
Once the tin plated pins are pressed in there are little shavings
over the board area . . . I plan to turn in my engineer's pocket protector
and
> it would be afterwards, especially if the baking were being done
> "casually",
> and not under strict minimum time and temperature guidelines.
>
We can always tighten up the procedures especially when they don't
'seem' critical to those doing the work.
> Check to see if you have corrosion before soldering, perhaps by running a
> bare panel down the solder line, with no flux and/or baking?
>
Will do. I feel the urge to do several experiments coming on. To
check the solder mask, the baking, the wave.
> Good luck = Hard Work
>
Hans
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