In a message dated 4/21/06 19:32:40, [log in to unmask]
writes:
> Werner, can or do you have any data you can share about the
> pad size verses a round pads, etc.?
>
Hi Scott,
I published the result of this study. the reference is:
Engelmaier, W., “BGA and CGA Solder Attachments: Results of Low-Acceleration
Test and Analysis,” Proc. Surface Mount International Conf., San Jose, CA,
August 1995, pp. 344-358.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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