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July 2003

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Subject:
Alternative finishes
From:
Murulidhara S <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 15 Jul 2003 14:11:15 +0530
Content-Type:
multipart/alternative
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text/plain (1069 bytes) , text/html (1644 bytes) 
Dear Technetters,

There are so many alternatives finishes to the conventional Hot Air Solder Leveling such as ENIG, OSP, Immersion Silver and Immersion Tin. In all these foinishes there are aome advantages and disadvantagges. I want to know which finsh is most suitable for pcbs with SMDs. & which is most popular.

Murulidhara.S

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