LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

August 1998

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET August 1998

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Condense Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Mime-Version:	1.0
Sender:	TechNet <[log in to unmask]>
Subject:	Solder Bridges
From:	Nick Nicolaides <[log in to unmask]>
Date:	Mon, 24 Aug 1998 13:05:34 -0400
Content-Type:	text/plain
Reply-To:	"\"TechNet E-Mail Forum.\" <[log in to unmask]>, Nick Nicolaides" <[log in to unmask]>
Parts/Attachments:	text/plain (30 lines)

Our CM (Contract Manufacturer) requested to use HASL rather then OSP. The CM
wanted 100 micro inches of tin lead plate for the BGA (for the HASL) and
they followed with about 6 mils of solder paste. As we began testing we
discovered we had numerous solder bridges under the BGA. Should we use any
HASL on the pads (plating) since the CM already uses 6 mils of solder paste?
Is this too much solder? Any suggestions?

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2

LISTSERV.IPC.ORG