Hello Technetters,

We are doing a job of soldering around 4500 pins into a Glass Epoxy
Multilayer PCB of size 288 x 200 mm. The pins are first push fit into the
PCB . The pins protrude on both sides of the PCB . On once side the pins
will mate with a connector, and on the other side wires are wrapped on. 1
Solder ring ( 0.9 mm dia ) is then put over each pin . The board is then put
in a reflow over for 180 sec at 235 deg C. We find that the solder joint are
not properly formed, and the finish is quite dull. The solder ring is
composed of 62% Tin, 2 % Silver, 34 % Lead. The solder flows out to the
other side of the PCB , but is not quite enough. We also notice
discoloration of the PCB after this cycle.

What are the issues  that we need to be looking at here, to get a better
joint with a better finish . We are completely new to this .

Appreciate some inputs and tips on doing this

With warm regards

Deepak Kuriyan
Framatome Connectors OEN

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