Hello Technetters, We are doing a job of soldering around 4500 pins into a Glass Epoxy Multilayer PCB of size 288 x 200 mm. The pins are first push fit into the PCB . The pins protrude on both sides of the PCB . On once side the pins will mate with a connector, and on the other side wires are wrapped on. 1 Solder ring ( 0.9 mm dia ) is then put over each pin . The board is then put in a reflow over for 180 sec at 235 deg C. We find that the solder joint are not properly formed, and the finish is quite dull. The solder ring is composed of 62% Tin, 2 % Silver, 34 % Lead. The solder flows out to the other side of the PCB , but is not quite enough. We also notice discoloration of the PCB after this cycle. What are the issues that we need to be looking at here, to get a better joint with a better finish . We are completely new to this . Appreciate some inputs and tips on doing this With warm regards Deepak Kuriyan Framatome Connectors OEN ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################