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September 1999

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Subject:
From:
Jason Smith <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 30 Sep 1999 08:28:37 -0400
Content-Type:
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On some boards, we've had to apply flux to the topside to promote wicking up to
the topside.  Especially for square pegs in round holes.   We run noclean with
nitrogen too!  You'll have to be careful though not to spead the flux out on the
neighboring components.



[log in to unmask] on 09/30/99 02:32:19 AM

Please respond to [log in to unmask]; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: Jason Smith/Lex/Lexmark)
Subject:  [TN] Wave soldering




Hi all,

What is the minimum vertical fill of solder for plated through holes ?

We have some problems to obtain the 75% requested by IPC-A-610 for a class 2
board.
In fact, the board has a thickness of 3,2 mm.
We use a no-clean flux and the wave is under nitrogen.

Is there any special criteria regarding to the thickness of the board ?
Has anyone succeeded in obtaining a correct solder filet for thick boards ?

Thanks,

Vincent Bada
Process Engineer
Alcatel Etca
Charleroi
Belgium

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