TECHNET Archives

August 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet Mail Forum<[log in to unmask]>
Subject:
Re[2]: [TECHNET] Solder mask material -Reply
From:
TOM BRESNAN <[log in to unmask]>
Date:
Thu, 14 Aug 1997 17:42:41 PST
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, TOM BRESNAN <[log in to unmask]>
Parts/Attachments:
text/plain (12 lines) 
     Another alternative, if you feel you need the reflowed solder, is to
     relieve the mask from the widest traces (over .050) to prevent the
     problem. There are some guidelines for this in IPC-D-275 (5.5.1) or
     its replacement document...


______________________________ Reply Separator _________________________________
Subject: Re: [TECHNET] Solder mask material -Reply
Author:  "TechNet Mail Forum." <[log in to unmask]>,          annie laberge
<[log in to unmask]> at INTERNET_GATEWAY

ATOM RSS1 RSS2