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| Date: |
Thu, 2 Sep 1999 09:38:58 -0600 |
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1.0 |
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7bit |
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text/plain; charset=us-ascii |
| Organization: |
Micron Technology |
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We're doing our first board using high pincount BGA's, and I understand
that we should be an immersion gold finish to get the flatness needed
for BGA assembly. My question is, how do I specify this type of finish
to the fab house? I assume thickness is one of the factors; what is
typical and what are the considerations in thickness spec? What else
needs to be specified?
The board in question is 9x14", 18 layers, a prototype build on a board
that will never see high volumes (about 100 units max lifetime
production). Environment is labratory, internal company use only.
TIA
Gary Crowell
Micron Technology
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