Scott,
Hewlett-Packard (and now the former Compaq) has been using electroplated
Ni-thin gold (3-5 u-inches) for over 30 years without any soldering
problems (and as they report it- NEVER a hole failure).  You can't  get
much thinner in an electroplating gold bath than the 3-5 u-inches (0.1
micrometers), so I don't see why there is a need to plate Pd over the
nickel.  This usually is reserved for THICK gold platings over nickel  (in
the 20 - 50 u-inch range) that is used for contacts or switch surfaces. As
an ENIG replacement is has to cost more.

Ask them why they don't offer you the 3-5 u-inch over nickel plating
option - that's what we plate on the HP boards.

Happy Holden
Westwood Associates/NanYa PCB





Scott Lefebvre <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
06/24/2003 02:51 PM
Please respond to "TechNet E-Mail Forum."; Please respond to Scott
Lefebvre


        To:     [log in to unmask]
        cc:
        Subject:        [TN] Electro-Plated Ni/Pd/Au vs [ENIG]


I have a new board shop promoting their Electro-Plated Ni/Pd/Au (hard or soft gold) surface finish over our existing [ENIG] boards.  We have not had any issues with our current assemblies using
[ENIG].  I am requesting any advice or information on Electro-Plated
Ni/Pd/Au and if it would be worth switching to it.  Any advice would be
greatly appreciated, thank you in advance.

SCOTT



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