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January 2002

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Jack Crawford <[log in to unmask]>
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Fri, 11 Jan 2002 16:33:00 -0600
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>>> [log in to unmask] 01/11/02 03:49PM >>>
CALL FOR PARTICIPATION
IPC and JEDEC bring you the International Conference on Lead-Free Electronic Assemblies
April 30, 2002  - Education Courses
May 1-2, 2002 - Technical Conference 
San Jose,  California


IPC - the Association Connecting Electronic Industries and JEDEC - the Solid State Technology Association are sponsoring an International Conference on Lead-Free Electronic Assemblies. The conference will be held April 30 - May 2, 2002 in San Jose, CA.  Mr. Marty Freedman of Molex and Mr. David Bergman of IPC are the Conference Chairs.

The European Union marches closer to establishing a firm date for lead elimination in most electronics.  Public and political pressure against lead continues to grow, especially outside the US.  Japan, Denmark and the European Union (EU) are all proposing bans on lead and products containing lead.  International OEMs are becoming more sensitive to the issue and continue to press their suppliers to develop plans.  A ban in Europe will have an effect in the global marketplace, which will force many US manufacturers to eliminate lead as effectively as a US ban.

Data is now coming in from individual companies' and consortia efforts.  Many challenges still exist and the path forward to success is not one of consensus.  Companies need to stay aware of the hot issues remaining in order to focus efforts that will allow success to be achieved by 2006/7.

Papers are sought in all areas, including: 
·     Policy - European Lead Ban status 
·     Component issues 
·     Design issues
·     Environmental health and safety effects (on the alternatives too!)
·     Material availability and toxicity issues
·     PWB issues
·     OEM/Consumer demands/voluntary elimination dates 
·     Recycling options 
·     Substitution - New commercially available alloys/conductive adhesives/ease of replacement
·     Cost issues
·     Reliability evaluations 
·     Roadblocks to implementation
·     Finishes issues - Organic solder protectants, immersion tin, silver, electroless nickel, palladium, etc.

The International Lead-Free Conference offers time slots between 30-45 minutes long. Some papers may be grouped together in a forum or panel discussion.

To submit an abstract, please complete the second page of this form and include an abstract of 200-300 words along with a brief biography (or you may provide the same information via e-mail to [log in to unmask]). The deadline for abstract submission is February 22, 2002.

Presentation materials and papers must be non-commercial in nature, focusing on technology rather than a company's product. It is mandatory to provide a print-quality paper or hard copies of visuals for the conference proceedings in order to deliver an oral presentation. If your paper is accepted, the deadline for paper submission is April 7, 2002.

Speakers at the conference will receive free admission to the conference, including lunch both days, proceedings, and admission to an evening reception on June 12th. The Conference-only registration fee is $450 for IPC/JEDEC member companies and $550 for non-members.  Course-only registration is $295 for members and $395 for non-members.

Complete and mail, fax or e-mail your biography and abstract to:

Robert Vitas, Vice President of Professional Development
IPC - Association Connecting Electronics Industries
2215 Sanders Road
Northbrook, IL 60062-6135 - USA
Fax: (847) 509-9798 / E-mail: [log in to unmask]

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