TECHNET Archives

May 2006

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Soldermask adhesion over vias?
From:
"Whittaker, Dewey (AZ75)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (AZ75)
Date:
Tue, 16 May 2006 07:53:52 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (60 lines) 
The pending release of the D revision of IPC-SM-840 establishes the
adhesion requirements you were concerned about.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Tuesday, May 16, 2006 5:31 AM
To: [log in to unmask]
Subject: [TN] Soldermask adhesion over vias?

Can I / should I expect the same level of soldermask adhesion over vias
as
over the copper plane or laminate?  I have PCBs that have poor adhesion
of
soldermask over the via pads, but acceptable everywhere else.  Many vias
are
now bare copper, and the vias that are covered easily fail any tape
adhesion
test.

How should I specify adhesion requirements on a drawing?  IPC-SM-840?

Thanks,



Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.




---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2