The pending release of the D revision of IPC-SM-840 establishes the
adhesion requirements you were concerned about.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Tuesday, May 16, 2006 5:31 AM
To: [log in to unmask]
Subject: [TN] Soldermask adhesion over vias?

Can I / should I expect the same level of soldermask adhesion over vias
as
over the copper plane or laminate?  I have PCBs that have poor adhesion
of
soldermask over the via pads, but acceptable everywhere else.  Many vias
are
now bare copper, and the vias that are covered easily fail any tape
adhesion
test.

How should I specify adhesion requirements on a drawing?  IPC-SM-840?

Thanks,



Kevin Glidden
Manufacturing Engineer
Luminescent Systems Inc.




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