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June 1998

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Sender:
TechNet <[log in to unmask]>
X-To:
"Modular Components National, Inc." <[log in to unmask]>
Date:
Fri, 19 Jun 1998 15:37:01 -0400
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Lenny Kurup <[log in to unmask]>
Subject:
Re: Gold to nickel adhesion
From:
Lenny Kurup <[log in to unmask]>
In-Reply-To:
<[log in to unmask]>
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TEXT/PLAIN (22 lines) 
The ammoniacal etchant must be controlled very closely  during the
etching cycle, remember most ammoniacal etchants carry chlorides, what is
happening is attack of the nickel under the gold
via the side walls, leading to a weakened gold layer, resulting in peeling.

Good Luck
Lenny Kurup
EMX Enterprises Ltd
Markham, Ontario

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