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Subject:	Re: Electro-Plated Ni/Pd/Au vs [ENIG]
From:	"Bresnan, Thomas" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 24 Jun 2003 14:22:23 -0700
Content-Type:	multipart/alternative
Parts/Attachments:	text/plain (2372 bytes) , text/html (6 kB)

I have to think it's as simple as, they have an electroplate line and not an
ENIG line. From experience, it's almost impossible to control the
electroplate gold in the thickness (thinness) range to "replace" ENIG. I'd
say your statement below speaks volumes "We have not had any issues with our
current assemblies using [ENIG] ".
-----Original Message-----
From: Scott Lefebvre [mailto:[log in to unmask]]
Sent: Tuesday, June 24, 2003 1:52 PM
To: [log in to unmask]
Subject: [TN] Electro-Plated Ni/Pd/Au vs [ENIG]


I have a new board shop promoting their Electro-Plated Ni/Pd/Au (hard or
soft gold) surface finish over our existing [ENIG] boards.  We have not had
any issues with our current assemblies using [ENIG].  I am requesting any
advice or information on Electro-Plated Ni/Pd/Au and if it would be worth
switching to it.  Any advice would be greatly appreciated, thank you in
advance.

SCOTT
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