TECHNET Archives

July 2013

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
TechNet E-Mail Forum <[log in to unmask]>
Date:
Thu, 25 Jul 2013 23:34:06 +0000
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Louis Hart <[log in to unmask]>
Subject:
Tensile strength testing
MIME-Version:
1.0
Message-ID:
<[log in to unmask]>
Content-Transfer-Encoding:
quoted-printable
Content-Type:
text/plain; charset="us-ascii"
From:
Louis Hart <[log in to unmask]>
Parts/Attachments:
text/plain (15 lines) 
TechNetters, any recommendations for a tensile strength tester that could be used by a printed circuit fabricator for testing of electroplated copper? Thanks.

Louis Hart
Compunetics
Monroeville, PA
USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1232


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2