At 17:22 10/03/98 EST, you wrote:
>Hi
>
>Has anyone any information on barrel cracking associated with the use of
> electroless nickel (EN) under a gold finish. We have a problem with 0.3 mm
> via's in FR4 multilayer boards cracking after thermal shock at 260°C. We have
> other problems with this board but is there any information on what effect EN
> has under these conditions ?
>
>Any comments ?
Chris !
What is the thickness of the copper and what kind of the copper are You
plating ?
Do You perform any heat treatment on the boards before EN ? What about Your
procedures regarding heating of the samples before thermal shock ?
Best regards
Edward Szpruch
Eltek Ltd - Israel
Tel 972 3 9395050
Fax 972 3 9309581
E-mail : [log in to unmask]
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