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May 2001

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TechNet <[log in to unmask]>
Subject:
Lifted components (MELF Cylindrical Diodes)
From:
Becerra Alejandro <[log in to unmask]>
Date:
Tue, 8 May 2001 20:37:04 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Becerra Alejandro <[log in to unmask]>
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We have had problems with lifted components (Like tombstoning but the
component is lifted just above the solder in one pad)
The component is a MELF cylindrical diode.
We made solderability test (Dip and look) and we did not found any
differences between the terminals.
We measured the component and we did not found differences between the
diameter of the terminals.
The component length is 3.4 mm and the diameter is 1.5 mm.
I have pictures of the cross section of one defect but I could not attach
them in the mail.
Cross section shows that one terminal is "sink" in the solder causing a
lifting in the other terminal.
A 6 mil. stencil is used in this process.



Alejandro Becerra
Phone (915) 841-8439, Fax (915) 841-8401
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