TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Content-Type:
text/plain; charset="us-ascii"
Old-Return-Path:
Date:
Tue, 01 Oct 1996 15:07:27 -0400
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/6605
From [log in to unmask] Tue Oct 1 17:
02:12 1996
X-Sender:
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"kK8311.0.qyI.8NMKo"@ipc>
Subject:
From:
Jim Moritz <[log in to unmask]>
X-Loop:
Received:
by ipc.org (Smail3.1.28.1 #2) id m0v89kn-0000XFC; Tue, 1 Oct 96 13:41 CDT
X-Mailer:
Windows Eudora Light Version 1.5.2
Message-Id:
Parts/Attachments:
text/plain (18 lines)
We have been experiencing sporadic cracks in plated copper but don't know
where they come from. The problem is that after LPI they look like a break
through the whole trace. After microsectioning many of these we have found
that it never goes through the base copper - only plated copper. Has anyone
experienced this and if so what causes this and how is it corrected?

Thanks,
Jim 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2