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February 2000

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Sender:
TechNet <[log in to unmask]>
X-To:
Thomi <[log in to unmask]>
Date:
Sun, 6 Feb 2000 15:07:27 -0800
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, rampinc <[log in to unmask]>
Subject:
Re: electrical shorts in RCC (resin coated copper) build up layer
From:
rampinc <[log in to unmask]>
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RAMPinc.
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