We will follow your discussionl, because we have had some trouble that
may be related to ceramic chip capacitors. In our case it's believed to
have some connection with mechanical stress during soldering and also in
connection with tempcycling. As all know these creeps have a number of
properties like all ceramic material, which can cause microphony, can
cause electrical discharges and similar phenomenons. The specialists
talk in terms of Intrinsic breakdown, Thermal breakdown, Ionization
breakdown, Electromechanical breakdown, Piezoelectrical and
Ferroelectrical discharges and a lot more stuff that call for both one
and two doctors in Physics for discussion. Yves Ousten and his lab in
Bordeaux is probably fitted for advanced analysis and measurements in
terms of what is said above. We have scanned the whole globe for the
best capacitors and by that way we have avoided some of the failures
but, to be honest, we don't know exactly why we made progression! If
some of the random failures keep going on, we will consult Yves Ousten
for sure. Of course, the ceramic chip cap makers themselves must have
deep knowledge, and we have had delegations here from AVX, Kemet etc,
but Ousten's lab seems to work independently which can sometimes be
beneficial. Yve's adress is : [log in to unmask] /Ingemar
> Phil Hennigan
> 904-739-4116 (voice)
> 904-739-4200 (fax)
> [log in to unmask]
>
>
> -----Original Message-----
> From: Phil Hennigan - Jacksonville
> Sent: Friday, August 20, 1999 11:07 AM
> To: [log in to unmask]
> Subject: RE: [TN] Chip Capacitors
>
> C1812C334K5RAC / C1812C105K5RAC PART FAILURES
>
> Please put me in contact with someone who can
> discuss possible mechanical failures of the above listed Kemet
capacitors.
> We have had several electrical failures with the above parts and think
it
> could be due to physical stress on the parts. Please contact me if you
have
> any data on this possible problem with the 1812 package.
>
> [log in to unmask]
>
> Spoke with Jim Beaumont at Kemet in Orlando
this AM.
> He's working on getting us further info on these failure modes.
>
>
>
> We have had trouble with the above parts but
have no
> idea as to what our problem is at this time. They are supposed to get
back
> with us. We would be interested to know if others have had problems
with
> these footprint sizes (1812).
>
> thanks
>
> Phil Hennigan
> 904-739-4116 (voice)
> 904-739-4200 (fax)
> [log in to unmask]
> <mailto:[log in to unmask]>
>
>
> -----Original Message-----
> From: Edward Hare, <SEM Lab, Inc.>
> [SMTP:[log in to unmask]] <mailto:[SMTP:[log in to unmask]]>
> Sent: Friday, August 20, 1999 10:16
AM
> To: [log in to unmask]
> <mailto:[log in to unmask]>
> Subject: [TN] Chip Capacitors
>
> Hi all,
>
> I would like to hear from anyone who
can
> estimate their manufacturing
> yield impact due to failure of chip
> capacitors, i.e. due to cracks,
> leakage, etc. I have been doing
failure
> analysis on these types of part
> issues and I am trying to benchmark
expected
> yield and/or failure rates
> under "normal" conditions.
>
> Any help would be sincerely
appreciated!
>
> Best Regards,
> Ed Hare
> --
>
> SEM Lab, Inc.
> Scanning Electron Microscopy and
Failure
> Analysis
> Snohomish, WA
> (425)335-4400
> http://www.sem-lab.com
> <http://www.sem-lab.com>
>
>
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