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Sender:	TechNet <[log in to unmask]>
Subject:	Re: BGA REWORK
From:	Earl Moon <[log in to unmask]>
Date:	Mon, 12 Feb 2001 03:44:11 -0600
Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>, Earl Moon <[log in to unmask]>
Parts/Attachments:	text/plain (19 lines)

I'd use paste flux in production if feasible. However, when running a fair
number of parts, you must stencil solder paste. Rework allows using anything
that works. Paste flux works as you describe to ensure ball/pad compliance
making all balls part of the "plane." Have to draw the line for solder
pasting at .8 mm and above. Below, go with flux for uBGA and very fine pitch
CSP's.

Earl Moon

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