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October 1999

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TechNet <[log in to unmask]>
Subject:
MicroBGA stencil thickness and solder paste height
From:
John Harris <[log in to unmask]>
Date:
Fri, 29 Oct 1999 10:39:00 +1000
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"TechNet E-Mail Forum." <[log in to unmask]>, John Harris <[log in to unmask]>
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Guys,

What stencil thicknesses are typically being used for MicroBGA's?

What kind of solder paste height is considered to be enough for these
packages?

Thanks


John Harris

AEMS Pty Ltd

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