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April 2000

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Subject:
Re: Solder Leveling (HAL)
From:
Lon Weffers <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 19 Apr 2000 16:32:22 +0200
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hi Frank,

You might consider chemical tin. Ask your pcb manufacturer.
Greetings Lon
    -----Oorspronkelijk bericht-----
    Van: TechNet [mailto:[log in to unmask]]namens Frank Davies
    Verzonden: dinsdag 18 april 2000 12:56
    Aan: [log in to unmask]
    Onderwerp: [TN] Solder Leveling (HAL)


    Customer would like to have 4 to 5 microns of solder on the surface of
his board after HAL.The area with most concern looks like contact fingers.
Having trouble doing this without plugging holes. Any ideas or help would be
appriciated
    frank

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