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January 2011

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Subject:
TEST OF BARE DIE CIRCUITS
From:
Lars Wallin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lars Wallin <[log in to unmask]>
Date:
Tue, 25 Jan 2011 07:22:38 -0600
Content-Type:
text/plain
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text/plain (22 lines) 
Hello Technet,

Can anyone short describe which sort of test methods are used for testing bare die circuits? Are they tested on the Waffer level or after cutting.

Best Regards
Lars Wallin
IPC European Representative
Location: Stockholm, Sweden
Phone:  +46 8 26 10 07
Mobile: +46 70 212 74 39
Email: [log in to unmask]<mailto:[log in to unmask]>

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