Hello Technet, Can anyone short describe which sort of test methods are used for testing bare die circuits? Are they tested on the Waffer level or after cutting. Best Regards Lars Wallin IPC European Representative Location: Stockholm, Sweden Phone: +46 8 26 10 07 Mobile: +46 70 212 74 39 Email: [log in to unmask]<mailto:[log in to unmask]> --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/ContentPage.aspx?Pageid=E-mail-Forums for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------