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Sender:	TechNet <[log in to unmask]>
X-To:	"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Date:	Thu, 2 Oct 2003 13:28:36 -0700
Reply-To:	"TechNet E-Mail Forum." <[log in to unmask]>, David Harman <[log in to unmask]>
Subject:	Re: Ball Bond Shear
MIME-Version:	1.0
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Content-Type:	text/plain; charset="us-ascii"
From:	David Harman <[log in to unmask]>
Parts/Attachments:	text/plain (52 lines)

I used a plasma etcher in the past. That seemed to work without damage
to the chip. This works for plastic encapsulated devices. 

David Harman


-----Original Message-----
From: Karen Walters [mailto:[log in to unmask]] 
Sent: Thursday, October 02, 2003 7:14 AM
To: [log in to unmask]
Subject: [TN] Ball Bond Shear

What is the best way to decap devices so we can do ball bond shear
testing
(nitride acid, etc)????

Karen Walters
Customer Quality Engineer
SKYWORKS Solutions, Inc.
20 Sylvan Road
Woburn, MA 01801
t. 781.376.3599
f. 781.376.3320
c.781.844.2227

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