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Date : 15/11/96 17:49
Msg From: PROCESS ENGINEERING
WE ARE MANUFACTURING SIMM MODULES WHICH ARE IN THE FORM OF PANELS.
EACH PANEL HAS 10 SIMM MODULES( 5X2). ON AN AVERAGE WE ARE GETTING 4
TO 5 X- OUTS SIMM MODULES PER PANEL WHICH ARE NOT BEING POPULATED. WE
ARE FACING THE PROBLEM OF SOLDER BALLS IN BETWEEN THE LEADS OF IC's,
THIS PROBLEM IS RANDOM IN NATURE(i.e IT VARIES WITH NO. OF X- OUTS IN
A PARTICULAR PANEL.).
WE SUSPECT THAT THIS PROBLEM MAY BE BECAUSE OF VARIBLE THERMAL MASS
IN THE PANELS. IS THERE ANY WAY OF AVOIDING THIS PROBLEM. ALSO IS
THERE ANY GUIDLINE FOR THE ALLOWABLE NO. OF X - OUTS IN A PANEL THAT
WILL NOT AFFECT THE THERMAL MASS OF THE PANEL SIGNIFICANTLY.
REGARDS
AJAY AGARWAL
ALTOS INDIA LIMITED
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