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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 12 Jul 2000 20:05:58 EDT |
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In a message dated 07/12/2000 4:35:22 PM Central Daylight Time,
[log in to unmask] writes:
> Hello technetters,
>
> I'm having a strange problem at my new digs. We have an outer-arrayed 256
> pin BGA going on a 6 layer FR-4 board. Everything is standard. The problem
> is the rework. We have a Conceptronic station and the nozzle we are using
> does not fully encapsulate the component. It always stays about 1/8" off
the
> board. Therefore, I am not getting full underside airflow. The techs are
> using extremely high temperatures to get the component to reflow. I am
> wondering this: if I run a standard profile (using previous BGA reflow
> experience) and the part won't even begin to reflow, can I chalk it up to
> the airflow problem. I am guessing that the reason that using abnormally
> high temps is reflowing the part, then it's only happening by conduction
> through the part, not proper heat getting under it. Also, in this regard,
if
> I'm only reflowing by conduction through the part, then what's happening to
> the integrity of the part? Please help.
>
> Jason Gregory
> ACT Manufacturing-Production Supervisor
> Corinth, MS.
> (662)287-3771 x470
Hi Jason!
What is this part? Is it one of the newer T.I. parts? The ones with the
heat-sink in it? That may be a part of the problem. The newer BGA's have
heat-sinks incorporated in them and present a bunch of new problems during
manufacturing...
Just curious...
-Steve Gregory-
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