I have a tangential question for Doug regarding the BGA thermal cycling
performed with conformal coating as underfill...it looks like the BGAs in
question were completely underfilled with conformal coating (from the board
up to the underside of the BGA package). Is this correct? Any experience(s)
with the effects on solder joint fatigue/reliability when using thin film vapor
condensate parylene coating in leiu of acrylic or Loctite products for BGA
underfill?
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