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November 1997

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Sender:
TechNet <[log in to unmask]>
X-To:
Charles Elliott <[log in to unmask]>
Date:
Mon, 24 Nov 1997 18:41:28 -0800
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, David Hoover <[log in to unmask]>
Subject:
Re: Via in Pad for BGA
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From:
David Hoover <[log in to unmask]>
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Charles,

You know HADCO has uVia offerings. We can do
prototype quantities down to .008" drilled holes
and laser drilled micro vias if required.

The above comments are of my own opinion, and
not necessarily that of my employer.

http://www.hadco.com:8080

Dave Hoover (aka, Groovy)
NPI Mgr HADCO TC2
Watsonville, CA

----------
From: Charles Elliott <[log in to unmask]>
To: [log in to unmask]
Subject: [TN] Via in Pad for BGA

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