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October 2002

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Sender:
TechNet <[log in to unmask]>
Date:
Wed, 2 Oct 2002 16:30:04 -0400
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Paul Truit <[log in to unmask]>
Subject:
Via clearance
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Organization:
RBB Systems Inc.
From:
Paul Truit <[log in to unmask]>
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text/plain (23 lines) 
On High density designs that will be wave soldered, What should the
minimum clearance from one unmasked via to another unmasked via be so
that solder bridges are not a problem?
--
Paul Truit, Mfg. Eng.
RBB Systems, Inc.
4265C E. Lincolnway
Wooster, OH  44691
Ph. (330) 567-2906 ext 514
Fax (330) 263-5324
Email: [log in to unmask]

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