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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 9 Jul 2002 08:57:18 EDT |
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Hi Victor,
There is no standardized shear-test for BGAs. The only value such a test has
is to see whether or not the failures occur as interfacial separation [=no
wetting of solder to on of the metallization pads/or weak metallization layer
adhesion], pad/resin adhesion failure [=proof of good solder joint], or
solder joint fracture [=proof of good solder joint]. Numerical values are
useless. Therefore, a test like Sun Microsystems "chisel test" [yes,=chisel
and hammer judiciously applied] is perfectly adequate.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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