Victor,

Blair is correct and you do not want to try to reflow the high-temp solderball.  It is there to maintain the column height.


Russell Nowland
Lucent Technologies, Suite 100
7725 West Reno Ave.
Oklahoma City, OK 73127
Phone: 405-782-7765
Fax: 405-782-7905
email: [log in to unmask]

-----Original Message-----
From: Blair K. Hogg [mailto:[log in to unmask]]
Sent: Thursday, March 06, 2003 3:00 PM
To: [log in to unmask]
Subject: Re: [TN] Solder ball composition


I haven't worked with BGA devices much, but I would suspect that you wouldn't want the balls to reflow during normal operations. Wouldn't the solder just spread out everywhere and the part collapse onto the board?

>>> [log in to unmask] 03/06/03 03:40PM >>>


Fellow TechNetters,

    What is the reasoning behind using High Temp Solder ( 95/5 ) for BGA's versus conventional
63/37 Eutectic solder besides different melting points?   Is the strength factor an issue.

I would like to hear from the metallurgical group on this issue.

Victor,

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