Hi,

We've been having a discussion regarding the wash pressures needed to
adequately clean under low profile components while not exceeding pressures
that are recommended by some surface mount switch and relay vendors.  I'm
curious as to what range of pressures are generally being used to clean
water-soluble fluxes?  I realize that some of this is a function of
component height, density, etc. but would be interested in data that anyone
would care to share.

As a related item, does anyone know of any published material detailing what
are minimum clearances that parts need to overcome water surface tension
(with or without surfactants) allowing them to be cleaned under?


Thanks in advance.

Rick Thompson

Sr. SMT Process Engineer
SMTEK International, Inc.
+1 (805) 532-2800
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