Hi, We've been having a discussion regarding the wash pressures needed to adequately clean under low profile components while not exceeding pressures that are recommended by some surface mount switch and relay vendors. I'm curious as to what range of pressures are generally being used to clean water-soluble fluxes? I realize that some of this is a function of component height, density, etc. but would be interested in data that anyone would care to share. As a related item, does anyone know of any published material detailing what are minimum clearances that parts need to overcome water surface tension (with or without surfactants) allowing them to be cleaned under? Thanks in advance. Rick Thompson Sr. SMT Process Engineer SMTEK International, Inc. +1 (805) 532-2800 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------