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Date: | Tue, 23 Mar 1999 11:44:25 -0000 |
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Michael
Sorry for this tardy reply - been a little busy of late.
Just a note of caution. If you are intending to run some form of SIR test,
then ensure that the dummy components that you use are exactly that -
plastic dummy not real component rejects - it does make a difference.
As a guide, you should specify Dummy components for SIR testing.
Hope this helps
Regards, Graham Naisbitt
[log in to unmask]
Concoat Ltd Phone: +44 1276 691100
Alasan House Fax: +44 1276 691227
Albany Park
CAMBERLEY
GU15 2PL UK
-----Original Message-----
From: Becker, Michael (Towson) <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: 17 March 1999 20:18
Subject: [TN] Dummy BGA Components
>I am trying to locate dummy BGA components to simulate an Intel pentium
>processor chipset. There are two style BGA's. I require a daisy chain
>for quick electrical testing of the solder joints after thermal cycling.
> I have contacted Topline and Practical components. They have neither.
>1) 352 BALL SUPER-BGA (this is a cavity down not a glob top) perimeter
>balls only 1.27mm spacing
>2) 324 Glob top with 288 perimeter balls and 6x6 array of thermal balls
>in the center 1.27 mm spacing
>
>Any help is appreciated.
>Something close would work possibly.
>
>Thanks,
>
>Michael
>
>Mechanical Engineer - MATT / BMATT Raytheon
>[log in to unmask] 1300 East Joppa Rd
>AOL Instant Messenger - MBecker999 Baltimore MD, 21286
>
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