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August 2001

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Subject:
Gold Tin Solder
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 22 Aug 2001 17:02:55 -0400
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We are looking for a resource, someone with experience evaluating Ag80SN20
solder process. Specifically concerning the microstructure of the
intermetallic interface. We will need to talk off line.

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask]
Ph: (610) 362-1200 x107
Fax: (610) 362-1290

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