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Sat, 28 Sep 1996 09:38:20 +0800 |
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by ipc.org (Smail3.1.28.1 #2)
id m0v6oDy-00005OC; Fri, 27 Sep 96 20:29 CDT |
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| From [log in to unmask] Mon Sep 30 11: |
07:19 1996 |
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Shaun,
I ever face this situation before. I have done 2 different ways to resolve
issue.
First, I am using a low-temp solderpaste (42Sn/58Bi), that melt at 138 deg.C
and reflow at about 179 deg.C.
Second way is to use fixture, but some how you did the same thing too. I guess
you should try to cool the board as slow as possible. Or try to make sure that
your fixture holds the board tightly during process and cooldown.
I hope it help...
--------------------------------------------------------------------------
At 12:45 PM 9/27/96 -0500, you wrote:
> Is anyone out there familar with Rogers 5880 teflon laminate? I am
> processing a double sided board that comes out curled up when it exits
> the reflow oven. The use of a fixture to hold the board flat during
> the process and allowing it to cool in the fixture does not help.
> When you try to straighten the board out the result is cracked chip
> components. I would appreciate any help that you can give me with
> this situation.
>
> Shaun Dalton
> [log in to unmask]
>
>
Poh Kong Hui
Nera Electronics
Fax: (65) 7765492
=-=-=-=-=-= -=-=-=-.=.=.=.=.=.=.=.=.=.=.=.=. ==.=.=.
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