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38:56 1997 |
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\0
TO: I4235700 IBMMAIL new address for ipc technet 25.6.96
FROM: DSTEWART EX2 D.Stewart - Product Development Manager.
DATE: 22 January 1997
SUBJECT: RAW CARD MFG PROCESS
Check the electroplated copper thickness in the through holes.
As the carbon has a lower conductivity than copper, if it is plated
under normal cycle conditions, it takes time to bridge the hole
with copper. If your supplier does not wish to increase his plating
time in the acid copper bath, you may find less copper in the hole
than expected or specified. He may do a strike plate after
Blackhole, similar to the low build/strike process, in which case
it will look the same as electroless.
The views expressed are my own and may not reflect those of my
employer
Dougal
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