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Hello Technet,
In the near future I have to assemble boards with Alpha Staystick
adhesive pads (a thermally conductive material) underneath fine-pitch
devices. If handsoldering is to be avoided, the pad must be placed after
stencil printing, prior to placing the component and soldering by
IR/convection reflow. To enable complete filling of the gap, the bottom
of the leads is at the same level as the bottom of the package body (no
stand-off). Unfortunately the design can not be changed.
My question is : How will the adhesive pads affect the number of
misaligned components on the soldered boards ? Is it better to use
manual soldering ?
-- Daan Terstegge --
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