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August 2001

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Subject:
From:
Timothy Reeves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 20 Aug 2001 11:36:20 -0700
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This test should also be done at 500 deg F, not 480.
T Reeves

-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Monday, August 20, 2001 9:42 AM
Subject: Re: Solder Testing


J-STD-003   4.2.3.4.1 After fluxing and draining per  . . . slide the coupon
gently on molten solder. Allow coupon to float on solder for 5 seconds
maximum. The coupon may be depressed into the solder bath to a maximum of
50% of the coupon thickness after it has been initially floated on the
solder. After the elapsed time, slide the coupon off molten solder. Hold
coupon still and horizontal until solder solidifies. 
 
Guy Ramsey 
Senior Lab Technician / Instructor


E-Mail:  <mailto:[log in to unmask]> [log in to unmask]
Ph: (610) 362-1200 x107
Fax: (610) 362-1290

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Michael Lester
Sent: Monday, August 20, 2001 11:05 AM
To: [log in to unmask]
Subject: [TN] Solder Testing


Can someone tell me if there is a standard dwell time in a solder float
test? 
2 inch square coupon using Kester Non-Activated flux,temperature of 480º   
Thanks for the help. 



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